5961-01-252-1008
Find complete technical information, availability, and procurement data for: 5961-01-252-1008
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Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes:devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see rectifier, semiconductor device. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see microcircuit (as modified). Excludes:network (as modified); absorber, overvoltage; semiconductor device set; and semiconductor device assembly. Do not use if more specific name applies.
1.125 inches nominal overall diameter, 5.120 inches nominal overall length, 55.0 celsius ambient air maximum operating temp per measurement point, silicon all semiconductor semiconductor material
Product Characteristics
Below you’ll find the complete technical specifications and performance data for this part, including material details and compliance information.
- Overall Length
- 5.120 inches nominal
- Overall Diameter
- 1.125 inches nominal
- Semiconductor Material
- silicon all semiconductor
- Maximum Operating Temp Per Measurement Point
- 55.0 celsius ambient air
Related Parts
This NSN group includes multiple components designed to meet specific performance and operational standards. Each listing provides detailed specs, functionality data, and replacement compatibility information:
| Part Number | Name |
|---|---|
| C23174 | Unitized Semiconductor Devices |
FAQs
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