NSN 8040-01-121-3868

Adhesive

FSC: 8040 NIIN: 011213868

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NSN 8040-01-121-3868 Description

Paste physical form, for bonding semiconductors specific usage design, separate catalyst features provided, thermally conductive .

Product Characteristics

NSN:

8040011213868

Demilitarization:

INC:

11297

Shelf Life:

N/A

Physical Form:

Paste

Specific Usage Design:

For bonding semiconductors and other electronic components to chassis or heat sinks

Features Provided:

Separate catalyst

Special Features:

Thermally conductive

Color:

Natural

Material:

Plastic epoxy

Part Numbers

22374
SMITHS AEROSPACE INC. ELECTRONIC
DELTABOND 152/A-4
WAKEFIELD THERMAL SOLUTIONS, INC.

Shipping & Handling

HMIRS:

No information in HMIRS. MSDS should be available to the user.

ESD:

No known electrostatic discharge.

Professional Distribution

ITAR Registered
DDTC Registered
HAZMAT Certified
AS9120 Quality Standards
100% Quality Inspections

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Cage Codes

SMITHS AEROSPACE INC. ELECTRONIC - 30377

WAKEFIELD THERMAL SOLUTIONS, INC. - 1L2W5