NSN 5998-01-522-0259

Backplane Assembly

FSC: 5998     NIIN: 015220259

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Product Characteristics

NSN:
5998015220259
Demilitarization:
DEMIL/MLI
INC:
34736
Shelf Life:
N/A
End Application:
Nsn 4940-01-471-6396, electronic shop, transportable; w/s: missile, patriot
Part Name Assigned By Controlling Agency:
Wirewrap board, assembly - mother board
Special Features:
Board: glass epoxy (multilayer) type gf per mil-p-13949; printed circuitry shall be 2 oz copper; connector and terminal holes plated through, mil-std-275; solder coat all exposed copper surfaces and plated through holes, mil-std-275, followed by reflow; apply polymer shlder mask coating in selective areas to support marking requirements on component side (layer 1) and dip side (layer 4) conforming to ipc-sm-840, class 3, color green; fabricate per mil-p-55110.

Part Numbers

  • 8160-MLT21
    C-MAC PACKAGING SYSTEMS INC
  • A31U29801-1
    NORTHROP GRUMMAN SYSTEMS CORPORATION

Shipping & Handling

HMIRS:

No MSDS. No hazardous material.

ESD:

No known electrostatic discharge.

Schedule B:

8542900000 - Electronic integrated circuits and microassembly parts.

Professional Distribution

  •   ITAR Registered
  •   DDTC Registered
  •   HAZMAT Certified
  •   AS9120 Quality Standards
  •   100% Quality Inspections
ITAR registered supplier

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NSN: 5998-01-522-0259 backplane assembly
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