NSN 5962-01-576-4945

5962015764945

DEMIL/MLI

31778

N/A

Low stress injection molded plastic

Leadframe material, copper alloy; dimensions are in inches (millimeters); dimension does not include moldflash of 0.15mm per side; dimension does not include moldflash of 0.25mm per side; all ground leads and ground paddle must be soldered to pcb rf ground; this item is a low-cost spdt switch in 8-lead grounded base msop packages; the desigm has been optimized to provide high isolation with minimal insertion loss for medium and low power applications; on-chip circuitry allows positive voltage control operation at very low dc currents with control inputs compatible with cmos and most ttl logic families