NSN 5962-01-108-8797

Memory Microcircuit

FSC: 5962     NIIN: 011088797

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Product Characteristics

NSN:
5962011088797
Demilitarization:
DEMIL/MLI
INC:
41015
Shelf Life:
N/A
Body Length:
1.290 inches
Body Width:
Between 0.500 inches and 0.610 inches
Body Height:
Between 0.150 inches and 0.205 inches
Maximum Power Dissipation Rating:
1.4 watts
Operating Tempurature Range:
-55.0/+125.0 degrees celsius
Storage Tempurature Range:
-65.0/+150.0 degrees celsius
Features Provided:
Hermetically sealed and monolithic and positive outputs and bipolar and schottky and w/enable and 3-state output
Inclosure Material:
Ceramic and glass
Inclosure Configuration:
Dual-in-line
Output Logic Form:
Transistor-transistor logic
Input Circuit Pattern:
14 input
Case Outline Source And Designator:
D-3 mil-m-38510
Terminal Surface Treatment:
Solder
Voltage Rating And Type Per Characteristic:
5.5 volts power source
Time Rating Per Chacteristic:
125.00 nanoseconds propagation delay time, low to high level output and 125.00 nanoseconds propagation delay time, high to low level output
Memory Device Type:
Rom
Memory Capacity:
Unknown
Test Data Document:
81349-mil-m-38510 specification (includes engineering type bulletins, brochures, etc., that reflect specification type data in specification format; excludes commercial catalogs, industry directories, and similar trade publications, reflecting general type data on certain environmental and performance requirements and test conditions that are shown as "typical", "average", "", etc.).
Terminal Type And Quantity:
24 printed circuit
Specification Data:
81349-mil-m-38510/209 government specification

Part Numbers

  • 01-45240-20
    COMPUTER AUTOMATION INC
  • 143736-203
    HARRIS CORPORATION
  • 29633DM
    FAIRCHILD SEMICONDUCTOR CORP
  • 312213-001
    BAE SYSTEMS INFORMATION AND
  • 351-1949-020
    ROCKWELL COLLINS, INC.
  • 4014313-01
    RAYTHEON TECHNICAL SERVICES COMPANY
  • 4040967-604
    HONEYWELL INTERNATIONAL INC.
  • 477-1434-004
    BOEING COMPANY, THE
  • 5381-1
    MMI/AMD
  • 7823817
    OGDEN AIR LOGISTICS CENTER
  • AM27S181DM
    NORTHROP GRUMMAN CORP
  • BM1010-700
    NORTHROP GRUMMAN CORP
  • DM875181N
    NATIONAL SEMICONDUCTOR CORPORATION
  • JAN-M38510/20904BJX
    MILITARY SPECIFICATIONS
  • M38510/20904BJ
    MILITARY SPECIFICATIONS
  • M38510/20904BJB
    MILITARY SPECIFICATIONS
  • M38510-20904BJX
    MILITARY SPECIFICATIONS
  • MIL-M-38510/209
    MILITARY SPECIFICATIONS
  • MM6381-1J
    MMI/AMD
  • N82S181F
    PHILIPS SEMICONDUCTORS INC
  • RB825181F
    MILITARY SPECIFICATIONS
  • ROM/PROM HEAD 028
    DLA LAND AND MARITIME

Shipping & Handling

HMIRS:

No MSDS. No hazardous material.

ESD:

Has ESD sensitivity

Schedule B:

8542900000 - Electronic integrated circuits and microassembly parts.

Professional Distribution

  •   ITAR Registered
  •   DDTC Registered
  •   HAZMAT Certified
  •   AS9120 Quality Standards
  •   100% Quality Inspections
ITAR registered supplier

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