80000049-001

View detailed technical data, stock status, and sourcing information for: 80000049-001
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Federal Supply Group

Electrical and Electronic Equipment Components

Federal Supply Classification

5961 Semiconductor Devices and Associated Hardware

National Stock Number

5961-01-332-8502

Item Name Code

61962

Assigment Date

01/18/1991 (35 years ago)

A preformed item of various shapes, and contours, which may have a sandwich or honeycomb core bonded to a metallic or nonmetallic facing material. It is used to enclose integral portions of the fuselage or to form partitions or sections within a wing, empennage, fuselage, nacelle or crew compartment. It may have mounting provisions such as predrilled holes to facilitate installation, but will have no items attached to it except bracket (s) or other securing devices to accommodate its own mounting or support. It may be mounted by means of fasteners, bonding or welding. Excludes:panel, interior lining, aircraft; cover access; cover, access, aircraft; floor (1), aircraft; core material, cellular, structural.

1.573 inches maximum overall length, 1.050 inches maximum overall width, 5805-01-188-3993 central office,telephone,automatic end item identification, unable to decode inclosure material, 0.250 inches minimum and 0.350 inches maximum overall height

Product Characteristics

Below you’ll find the complete technical specifications and performance data for this part, including material details and compliance information.

Inclosure Material: unable to decode
Overall Length: 1.573 inches maximum
Overall Height: 0.250 inches minimum and 0.350 inches maximum
Overall Width: 1.050 inches maximum
End Item Identification: 5805-01-188-3993 central office,telephone,automatic
Mounting Facility Quantity: 2
Electrode Internally-Electrically Connected To Case: cathode
Component Name And Quantity: 2 semiconductor device diode
Mounting Method: unthreaded hole
Features Provided: burn in and hermetically sealed case and electrostatic sensitive
Semiconductor Material: silicon all semiconductor device diode
Voltage Rating In Volts Per Characteristic: 400.0 maximum reverse voltage, peak all semiconductor device diode
Current Rating Per Characteristic: 30.00 amperes maximum average forward current averaged over a full 60-hz cycle and 300.00 amperes maximum peak forward surge current all semiconductor device diode
Maximum Operating Temp Per Measurement Point: 150.0 celsius junction
Special Features: all semiconductor device diode junction pattern arrangement: pn
Terminal Type And Quantity: 2 pin and 1 case

Related Parts

This NSN group includes multiple components designed to meet specific performance and operational standards. Each listing provides detailed specs, functionality data, and replacement compatibility information:

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80-00049-001	Unitized Semiconductor Devices
80000049-001	Unitized Semiconductor Devices
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