BUZ54A
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An active semiconductor device with three or more electrodes. May or may not include mounting hardware and/or heatsink. Excludes:semiconductor device, diode and semiconductor device, thyristor. For solid state devices which are responsive to visible or infrared radiant energy, see semiconductor device, photo.
1.005 inches minimum and 1.099 inches maximum overall width, 0.250 inches minimum and 0.326 inches maximum overall height, unable to decode inclosure material, 2 mounting facility quantity, 1.510 inches minimum and 1.550 inches maximum overall length
Product Characteristics
Below you’ll find the complete technical specifications and performance data for this part, including material details and compliance information.
- Inclosure Material
- unable to decode
- Overall Length
- 1.510 inches minimum and 1.550 inches maximum
- Overall Height
- 0.250 inches minimum and 0.326 inches maximum
- Overall Width
- 1.005 inches minimum and 1.099 inches maximum
- Mounting Facility Quantity
- 2
- Internal Configuration
- field effect
- Joint Electronic Device Engineering Council/Jedec/Case Outline Designation
- to-3
- Mounting Method
- unthreaded hole
- Features Provided
- hermetically sealed case
- Semiconductor Material
- silicon
- Voltage Rating In Volts Per Characteristic
- 1000.0 maximum drain to source voltage and 1000.0 maximum drain to gate voltage
- Current Rating Per Characteristic
- 18.00 amperes maximum off-state current, peak and 2.90 amperes maximum drain current
- Power Rating Per Characteristic
- 125.0 watts maximum total device dissipation
- Maximum Operating Temp Per Measurement Point
- 150.0 celsius junction
- Terminal Type And Quantity
- 2 pin and 1 case
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FAQs
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What is the FSCG of the NSN 5961-01-332-8083?
Does the NSN 5961-01-332-8083 have a Schedule B code assigned?
Does NSN 5961-01-332-8083 require demilitarization?
Does NSN 5961-01-332-8083 contain precious materials?
Does NSN 5961-01-332-8083 contain hazardous materials?
When the NSN 5961-01-332-8083 was assigned to the Federal Catalog?
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