5961-00-136-6924
Find complete technical information, availability, and procurement data for: 5961-00-136-6924
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A bistable semiconductor device comprising three or more junctions which is normally a nonconductor until the application of a signal to a gate terminal, at which time the device switches to the conductive state. Includes devices capable of being switched back to the nonconductive state upon application of a different signal to the same or another gate terminal. May or may not include mounting hardware and/or heatsink. For solid state devices which are responsive to visible or infrared radiant energy, see semiconductor device, photo.
threaded stud mounting method, junction contact internal configuration, 0.330 inches minimum and 0.505 inches maximum overall length, 1 mounting facility quantity, unable to decode inclosure material
Product Characteristics
Below you’ll find the complete technical specifications and performance data for this part, including material details and compliance information.
- Inclosure Material
- unable to decode
- Overall Length
- 0.330 inches minimum and 0.505 inches maximum
- Mounting Facility Quantity
- 1
- Internal Configuration
- junction contact
- Mounting Method
- threaded stud
- Features Provided
- hermetically sealed case
- Overall Width Across Flats
- 0.544 inches minimum and 0.562 inches maximum
- Nominal Thread Size
- 0.250 inches
- Semiconductor Material
- silicon
- Voltage Rating In Volts Per Characteristic
- 200.0 maximum breakover voltage, dc
- Current Rating Per Characteristic
- 35.00 amperes maximum drain current
- Power Rating Per Characteristic
- 500.0 milliwatts maximum total power dissipation
- Maximum Operating Temp Per Measurement Point
- 150.0 celsius junction
- Special Features
- junction pattern arrangement: pnpn
- Thread Series Designator
- unf
- Terminal Type And Quantity
- 2 tab, solder lug and 1 threaded stud
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FAQs
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