5330-01-586-8001

Find complete technical information, availability, and procurement data for: 5330-01-586-8001
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Federal Supply Group

Hardware and Abrasives

Federal Supply Classification

5330 Packing and Gasket Materials

National Stock Number

5330-01-586-8001

Assigment Date

07/14/2010 (16 years ago)

Cancelled

This item was cancelled on: 11/01/2022.

A grouping of two or more different types of electrical/electronic components mounted on a common mounting. It may include an assembly of electrical/electronic components mounted on multiple printed wiring board(s) mounted back to back, stacked, and the like. The item is generally a component of a subassembly and cannot be assigned a more definite item name. Excludes:items which may be identified as a subassembly. For an assembly of electrical/electronic components mounted on a single printed wiring board, see circuit card asseembly. Do not use if a more specific name applies.

5330-01-586-8001, no name available

FAQs

Find helpful answers about installation, operation, maintenance, compliance, and troubleshooting.

What is the FSCG of the NSN 5330-01-586-8001?

The FSCG of the NSN 5330-01-586-8001 is 5330

Does NSN 5330-01-586-8001 require demilitarization?

Items subject to the export administration regulations (ear) in parts 730-774 of title 15, code of federal regulations (cfr) (ccli or ear99) and determined by dod to present a low risk when released out of dod control. No demil, mut, or end use certificate is required. May require an export licensefrom doc.

Does NSN 5330-01-586-8001 contain precious materials?

Item does not contain precious metal.

Does NSN 5330-01-586-8001 contain hazardous materials?

Indicates there is no information in the hmirs. The nsn is in a fsc in table ii of fed std 313 and a msds may be required by the user. The requirement for a msds is dependent on a hazard determination of the supplier or the intended end use of item.

When the NSN 5330-01-586-8001 was assigned to the Federal Catalog?

It was assigned 16 years ago, on Wed, Jul 14, 2010