ROM/PROM FAMILY 230
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A circuit designed to store information and/or coded instructions. Item has pins or other connections to install in a computer or computing device. Does not include magnetic drums, tapes, punched cards or the like. For items that have portable type connections see memory, portable, solid state.
leadless flat pack inclosure configuration, ceramic inclosure material, -55.0 to 125.0 celsius operating temp range, solder terminal surface treatment, programmed pal part name assigned by controlling agency
Product Characteristics
Below you’ll find the complete technical specifications and performance data for this part, including material details and compliance information.
- Operating Temp Range
- -55.0 to 125.0 celsius
- Inclosure Material
- ceramic
- Inclosure Configuration
- leadless flat pack
- Terminal Surface Treatment
- solder
- Part Name Assigned By Controlling Agency
- programmed pal
- Voltage Rating And Type Per Characteristic
- 5.5 volts nominal power source
- Time Rating Per Chacteristic
- 80.00 nanoseconds maximum access
- Memory Device Type
- pal
- Terminal Type And Quantity
- 28 leadless
Related Parts
This NSN group includes multiple components designed to meet specific performance and operational standards. Each listing provides detailed specs, functionality data, and replacement compatibility information:
| Part Number | Name |
|---|---|
| 7542105P501 | Memory Microcircuit |
| 7548350G0119 | Memory Microcircuit |
| 7548350G119 | Memory Microcircuit |
| ROM/PROM FAMILY 230 | Memory Microcircuit |
FAQs
Find helpful answers about installation, operation, maintenance, compliance, and troubleshooting.
What is the FSCG of the NSN 5962-01-414-2648?
Does the NSN 5962-01-414-2648 have a Schedule B code assigned?
Does NSN 5962-01-414-2648 require demilitarization?
Does NSN 5962-01-414-2648 contain precious materials?
Does NSN 5962-01-414-2648 contain hazardous materials?
When the NSN 5962-01-414-2648 was assigned to the Federal Catalog?
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