5962-01-102-3114

Product Characteristics

Below you’ll find the complete technical specifications and performance data for this part, including material details and compliance information.

Body Length

1.060 inches maximum

Body Width

0.220 inches minimum and 0.310 inches maximum

Body Height

0.140 inches minimum and 0.185 inches maximum

Maximum Power Dissipation Rating

220.0 milliwatts

Operating Temp Range

-55.0 to 125.0 celsius

Storage Temp Range

-65.0 to 150.0 celsius

Features Provided

hermetically sealed and monolithic and low power and schottky and w/enable and 3-state output

Inclosure Material

ceramic

Inclosure Configuration

dual-in-line

Output Logic Form

transistor-transistor logic

Input Circuit Pattern

10 input

Design Function And Quantity

8 flip-flop, d-type

Case Outline Source And Designator

d-8 mil-m-38510

Terminal Surface Treatment

solder

Voltage Rating And Type Per Characteristic

7.0 volts maximum power source

Time Rating Per Chacteristic

37.00 nanoseconds maximum propagation delay time, low to high level output and 37.00 nanoseconds maximum propagation delay time, high to low level output

Special Features

nuclear hardness critical; no drawing to determine if isc code 1 item should also be nuclear hardness. can't change criticality code to reflect nuclear hardness

Test Data Document

"81349-mil-m-38510 specification (includes engineering type bulletins, brochures,etc., that reflect specification type data in specification format; excludes commercial catalogs, industry directories, and similar trade publications, reflecting general type data on certain environmental and performance requirements and test conditions that are shown as "typical", "average", "nominal", etc.)."

Terminal Type And Quantity

20 printed circuit

Specification/Standard Data

81349-mil-m-38510/325/usaf/ government specification

Replaces National Stock Numbers

Below is a list of NSNs that have been officially superseded by this NSN:

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FAQs

Find helpful answers about installation, operation, maintenance, compliance, and troubleshooting.

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