7050-01-165-9826
Find complete technical information, availability, and procurement data for: 7050-01-165-9826
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A grouping of two or more semiconducting devices such as light emitting diode; semiconductor device, diode; semiconductor device, photo; semiconductor device, thyristor; and/or transistor mounted on a common mounting or mounted on each other. The devices must be separable and each item must be capable of functioning in accordance with its given name. For assemblies consisting of semiconducting devices permanently cased, encapsulated, or potted together to form a single unit, see rectifier, semiconductor device, unitized and semiconductor devices, unitized. Excludes:semiconductor device set; microcircuit assembly; and microcircuit set. See also absorber, overvoltage.
aluminum alloy 2024-t4;finish clear or hard anodize per mil-a-8625b,type 3,class 1; bond 0.015 in. thk layer of shore 60 neoprene around outside surface; 1.500 in. lg.; 0.500 in. id; 1.592 in. od, 0.810 in. od for t-shaped capstan; 2 through holes 6-32 unc-2b 90.0 deg apart on smaller od special features
Product Characteristics
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- Special Features
- aluminum alloy 2024-t4;finish clear or hard anodize per mil-a-8625b,type 3,class 1; bond 0.015 in. thk layer of shore 60 neoprene around outside surface; 1.500 in. lg.; 0.500 in. id; 1.592 in. od, 0.810 in. od for t-shaped capstan; 2 through holes 6-32 unc-2b 90.0 deg apart on smaller od
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When the NSN 7050-01-165-9826 was assigned to the Federal Catalog?
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